| 摘要 |
A plating apparatus comprising a mask (3) having an opening at its center, a nozzle (2) for jetting a plating solution which is mounted so as to be directed to the opening of the mask, and a casing (4) covering a closed space (5) enclosed by the mask and the nozzle. In order to carry out an accurate plating upon a work surface (1), the mask (3) is closely contacted therewith so that the opening of the mask is identical with a profile of a partitive spot upon the work surface. The case (4) is provided with fluid discharge means (6) to maintain a negative air pressure within the closed space (5). The mask (3) is provided with outer air induction means (7) to introduce the outer air into the closed space (5). Thus, the used plating solution is discharged speedily into the fluid discharge means (6) by air flow introduced from the outer air induction means (7) and is prevented by the introduced air flow from permeating into the work surface (1) and the mask (3) surface respectively. |
