| 摘要 |
A diamond heatsink assembly for small electronic components such as microwave or millimetric wave devices comprises a frusto-conical shaped diamond 14 held on a support 10 by a clamping member 12 with a part-conical hole through it. One or both of the support and the clamping member are made of a high thermal conductivity metal such as gold, silver, copper or aluminium. The clamping member may be secured to the support by soldering friction welding, a screw thread or any other suitably tight clamping method. The diamond, the support and the clamping member may be metallised to reduce electrical skin resistance. <IMAGE> |
