| 摘要 |
<p>PURPOSE:To provide a metallized layer having a sufficient thickness as well as to simplify the dividing of an element by a method wherein, before performing a metallizing on the back side, a cut groove is provided on the back side of the wafer. CONSTITUTION:A thin film metal 4 is attached to the back side of a wafer and a cut groove 5 is formed. A thick metal layer 6 is formed utilizing said thin film 4. Then, when an element is divided by putting in a cleavage plane from the surface of an element, flaws and cracks are not generated on the element itself, thereby enabling to prevent the deterioration of characteristics of the element.</p> |
