| 摘要 |
PURPOSE:To prevent the excessive temp. rising or damage of a substrate, by assembling center magnets and outer peripheral magnets in adjacent sputtering electrodes so as to make the magnetic poles of said magnets opposite to each other and enabling the suppression of electron energy incident to the surface of the substrate from plasma. CONSTITUTION:A sputtering apparatus consists of a vacuum container 10, a substrate holder 11, a plurality of sputtering electrodes 14, 14', 14'', a sputtering power source system for supplying power to said elements and a gas control system for maintaining the pressure of the container 10. The aforementioned electrodes 14, 14', 14'' are equipped with plane targets 15, 15', 15'' opposed to substrates and arranged so as to form films to said substrates and the locus of the closed ring shaped drift motion of an electron is formed to each plane target by the restraint force of the electron due to an electromagnetic field. In this case, the targets 15, 15', 15'' are arranged so that the directions of electron drift motions on said targets become parallel at places nearest to adjacent electrodes. |
