发明名称 |
IMPROVED METAL BONDED DIAMOND AGGREGATE ABRASIVE |
摘要 |
An improved diamond aggregate abrasive is disclosed comprising milled saw diamond having an average size less than 75 microns held in a silver/copper alloy matrix which also contains a wetting agent for (e.g. titanium). Tests of grinding wheels containing this new aggregate have shown a marked improvement in grinding ratio over commercially available diamond aggregates. |
申请公布号 |
DE3262981(D1) |
申请公布日期 |
1985.05.15 |
申请号 |
DE19823262981 |
申请日期 |
1982.07.08 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
HAYDEN, STEPHEN CHARLES |
分类号 |
B24D3/00;B24D3/06;B24D3/34;C09K3/14;C22C26/00;(IPC1-7):B24D3/06 |
主分类号 |
B24D3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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