发明名称 IMPROVED METAL BONDED DIAMOND AGGREGATE ABRASIVE
摘要 An improved diamond aggregate abrasive is disclosed comprising milled saw diamond having an average size less than 75 microns held in a silver/copper alloy matrix which also contains a wetting agent for (e.g. titanium). Tests of grinding wheels containing this new aggregate have shown a marked improvement in grinding ratio over commercially available diamond aggregates.
申请公布号 DE3262981(D1) 申请公布日期 1985.05.15
申请号 DE19823262981 申请日期 1982.07.08
申请人 GENERAL ELECTRIC COMPANY 发明人 HAYDEN, STEPHEN CHARLES
分类号 B24D3/00;B24D3/06;B24D3/34;C09K3/14;C22C26/00;(IPC1-7):B24D3/06 主分类号 B24D3/00
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