| 发明名称 |
LEAD FRAMES FOR ELECTRONIC AND ELECTRIC DEVICES |
| 摘要 |
<p>An electronic part composed of an alloy comprising, as a basic metal or metals, Cr and Zr with the total amount thereof being between 0.3 and 2.0% by weight (provided that the amount of Cr is 1.5% by weight or less and that of Zr is 1.0% by weight or less) and Cu as a balance, the surface of said part having been coated with Sn. The electronic part according to the present invention is excellent in the wetting property of a solder, weather resistance of a solder and bonding property to Au and Al.</p> |
| 申请公布号 |
EP0084161(A3) |
申请公布日期 |
1985.05.15 |
| 申请号 |
EP19820111930 |
申请日期 |
1982.12.23 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
TESHIMA, KOICHI;YAMADA, MASAKAZU;SAKURAI, TOSHIHARU;ABE, TAKEMI |
| 分类号 |
H01L23/50;H01L23/48;H01L23/495;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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