PROCESS FOR PREPARING HIGH TEMPERATURE POLYIMIDE FILM LAMINATES

摘要

A process for fabricating large area void-free polyimide laminate structures wherein multiple ply polyimide film laminates may be constructed without decreasing the individual film strength and wherein layers of metal foil may be laminated between polyimide film layers to yield a flexible high temperature resistant structure having capabilities for use as flexible electric circuits in aerospace applications and the like.