发明名称 |
CIRCUIT MATCHING ELEMENTS |
摘要 |
The invention provides circuit matching elements primarily for integrated circuits and particularly for monolithic microwave integrated circuits. A transmission line in accordance with the invention is provided with a thin metallic film deposition disposed in the signal propagation path. The effect of the film is to increase the specific capacitance of the line without decreasing the specific inductance. The result is a slowing down and therefore a decrease of the wavelength of signals in the line. An example of an implementation of the invention is a coplanar waveguide having a central thick conducting line element (32) and outer thick conducting line elements (28,30) mounted on a substrate (21). The central element overlies a thin metallic film (22) which also underlies the outer conducting line elements and is insulated from the latter by polyamide insulation (24,26). |
申请公布号 |
EP0070104(A3) |
申请公布日期 |
1985.05.15 |
申请号 |
EP19820303126 |
申请日期 |
1982.06.16 |
申请人 |
THE SECRETARY OF STATE FOR DEFENCE IN HER BRITANNIC MAJESTY'S GOVERNMENT OF THE UNITED KINGDOM OF GREAT BRITAIN AND |
发明人 |
TURNER, BRIAN |
分类号 |
H01L21/3205;H01L23/52;H01L23/66;H01L27/13;H01P3/00;H01P3/08;H01P5/02;(IPC1-7):H01L23/56 |
主分类号 |
H01L21/3205 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|