| 摘要 |
<p>PURPOSE:To prevent lack of density, etc., by forming a resist mask, introducing an O2-contg. gas, and subjecting the mask to discharge before forming a dye layer through the vapor deposition method. CONSTITUTION:A photoresist is laminated on a base 1 made of glass or the like, exposed to UV light or the like through a pattern mask, and then, the exposed or unexposed parts are eluted with a developing soln. The base 1 on which an undermask is formed is set on a base holder 3 in a plasma vacuum vapor deposition vessel 2, and the vessel 2 is evacuated through an evacuation pipe 4. A gaseous Ar or the like contg. O2 is introduced through the pipe 4, voltage is impressed to the discharge electrode 7 to cause plasma for descumming the base 1. Vapor deposition to the base 1 is executed by again evacuating the vessel 2, opening a shutter 6, and heating a vapor deposition dye source 9.</p> |
