发明名称 VAPOR-PHASE ETCHING METHOD
摘要 PURPOSE:To enable the implementation of a processing at a lower temperature by a method wherein an irradiating light is made incident aslant on the surface of a substrate and, moreover, the direction of polarization of the irradiating light is so designed that it can be set to be vertical or parallel to a plane of incidence so that an angle of incidence and the direction of polarization may be selected to be on specified conditions as occasion calls. CONSTITUTION:Since an incident light 2 and reflected light 6 are in accord with each other in terms of both wavelength and frequency, the time average of an optical intensity is to have a distribution dependent periodically only on the distance from a substrate 1 as the result of the interference of the incident light 2 and the reflected light 6 on the surface of the substrate 1 in the case when the incident light 2 is regarded as a plane wave. The amplitude, period, phase and central value of this periodical distribution are determined by the complex index of refraction of the substrate 1 in the frequency of the incident light 2, the wavelength and the direction of polarization of the incident light 2, and an angle of incidence theta thereof. Even when the wavelength of the incident light 2 and the quality of the material of the substrate 1 are identical, the distribution of the optical intensity on the surface of the substrate 1 is varied by changing the angle of incidence theta and the direction of polarization of the incident light 2.
申请公布号 JPS61226928(A) 申请公布日期 1986.10.08
申请号 JP19850066468 申请日期 1985.04.01
申请人 HITACHI LTD 发明人 YAJIMA YUSUKE;TSUJII KANJI;MURAYAMA SEIICHI;OKUDAIRA HIDEKAZU;SHINTANI AKIRA;WADA YASUO
分类号 H01L21/302;(IPC1-7):H01L21/302 主分类号 H01L21/302
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