发明名称 SOLDERING DEVICE
摘要 PURPOSE:To spread solder to the part where the molten solder is inaccessible and to perform soldering with good quality by subjecting a printed wiring board on which parts are mounted to spray soldering then to jet soldering. CONSTITUTION:A printed wiring board 2 suspended from and attached to a conveyor 1 is coated with a flux by a fluxer 4 and is preheated by a preheater 5 and thereafter the wiring board enters a next sprayer 7. Solder spraying is started by an input sensor 6 and is stopped by an output sensor 8 so that the sprayed solder is spread to all the narrow parts of the parts. The wiring board is then subjected to jet soldering over a jet solder tank 9 and the excess solder is removed. The solder is spread thoroughly to the required parts and the influence of the gas generated by the solder is decreased. Soldering with good quality is thus accomplished.
申请公布号 JPS6082266(A) 申请公布日期 1985.05.10
申请号 JP19830186538 申请日期 1983.10.05
申请人 NIPPON DENKI KK 发明人 HASHIMOTO TAKAO
分类号 B23K1/08;H05K3/34 主分类号 B23K1/08
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