| 摘要 |
PURPOSE:To enable to connect via ball bonding, to improve the bonding strength and to enable to reduce the cost by containing specific amounts of Be and Si, thereby forming preferable balls. CONSTITUTION:A material which contains 0.002-0.2wt% of Be and 0.6-1.5wt% of Si, and the residue of aluminum is used. The Be serves to suppress the formation of the oxidized film of the aluminum at the time of forming balls by melting to form preferable balls, thereby improving the bonding strength. If the Be is less than 0.002wt%, the ball forming ability is not sufficiently improved, and if more than 0.2wt%, the ability is saturated and the cost increases. The Si enhance the strength of the wirings, the wire stretchability can be improved, and the bonding strength can be improved. If Si is less than 0.6wt%, the wiring strength, the wire stretchability and the bonding strength are insufficiently improved, and if more than 1.5wt%, the effects are not only obviated, but also the wirings and bonding strength are, on the contrary, deteriorated. |
