| 摘要 |
PURPOSE:To enable the sure surface treatment of a thin plate such as wafer by attaching a holding member for holding a wafer in the position distant from the shaft core of a rotary shaft in radial direction to the rotary shaft located in the vicinity of a liquid surface in a surface treatment tank and rotating and driving said rotary shaft. CONSTITUTION:The device is provided with a rotary shaft 15 located in the vicinity of a liquid surface when the device is contained in a surface treatment tank 1, 5, a holding member 6 which is attached to said rotary shaft 15 and holds a thin plate 2 such as wafer in the position distant from the shaft core of said rotary shaft 15 in radial direction, and driving means 13, 21, 14, and etc. for rotationally driving the rotation shaft 15. In an etching tank 1, for example, the holding member 6 is immersed in an etching solution 7 in a manner it almost sink. A rotational drive motor 13 rotates the holding member 6 through a belt 21, a pulley 14 for rotation, a rotary shaft 15, and a power transmission gear 12. The circulation of a liquid on a surface of the wafer 2 is promoted and uniform etching is done. The wafer 2 is brought in contact with the air and the etching liquid alternately, thereby removing the air bubbles deposited on the wafer and promoting the reaction such as oxidation. |
