摘要 |
<p>@ A leaf-type cooling device for coupling a semiconductor chip package to a heat sink is formed by accordion pleated folding of two copper strips (14, 16) coated on their non-mating sides with solder and their mating sides with polysulfone adhesive (18) and then using heat to solder the non-mating surfaces of strip folds together and the ridges defined by the folds to respective opposed solderable supports (22, 24). The polysulfone adhesive (18) is thereafter removed by solvation to form interleaved fins between the supports (22. 24). Springs function to bias the supports (22, 24) away from each other.</p> |