发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To diebond a pellet firmly by means of fixing the pellet through the intermediary of a metal layer comprising two layers i.e. an aluminum layer and a tin layer. CONSTITUTION:A silicon-made pellet 3 is diebonded on a tub 2 coated with a metal layer 9 with its surface excellently adhesive to tin through the intermediary of an aluminum layer 7 coatingly formed on the backside of the pellet 3 and a tin layer 8 further coatingly formed on the backside of the aluminum layer 7. The pellet 3 may be firmly diebonded on the tub 2 since aluminum is excellently adhesive to silicon as the pellet material which is also excellently adhesive to the material metal of pellet fixing surface.
申请公布号 JPS6079732(A) 申请公布日期 1985.05.07
申请号 JP19830186714 申请日期 1983.10.07
申请人 HITACHI SEISAKUSHO KK 发明人 MIYAMOTO KEIJI;KAWANOBE TOORU
分类号 H01L21/52;H01L21/58;H01L23/495 主分类号 H01L21/52
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