| 摘要 |
PURPOSE:To connect each element in a semiconductor laser-array electrically and severally, and to improve heat dissipating characteristics by fast sticking and fixing the upper section of the semiconductor laser-array by a mount formed from a material, which has high thermal conductivity and insulating properties. CONSTITUTION:A semiconductor laser-array 10 is constituted by four semiconductor lasers 11, and first electrodes 50 in the vicinity of active layers 12 are etched and grooves 13 reaching up to the depth of the active layers 12 are formed in the direction parallel with resonator axes 51 in the semiconductor lasers 11 so that each laser has electrical insulating properties. The second electrode 52 sides far from the active layers 12 are fusion-bonded on a heat sink 14 in the semiconductor laser-array 10. A mount 15 consisting of a high-resistance silicon wafer having high insulating properties is fitted on the semiconductor laser-array 11. |
