发明名称 |
Through-hole plating |
摘要 |
Compositions and process for the plating of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited metal plate. The process is characterized, in part, by the use of an activated permanganate solution.
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申请公布号 |
US4515829(A) |
申请公布日期 |
1985.05.07 |
申请号 |
US19830542036 |
申请日期 |
1983.10.14 |
申请人 |
SHIPLEY COMPANY INC. |
发明人 |
DECKERT, CHERYL A.;COUBLE, EDWARD C.;BONETTI, WILLIAM F. |
分类号 |
H05K3/42;C23C18/22;H05K3/00;H05K3/38;(IPC1-7):H05K3/42;H05K3/46 |
主分类号 |
H05K3/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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