| 摘要 |
PURPOSE:To improve the adhesive strength of patterns for connection by providing a through hole, where a metallic film is formed on the inside face at least, in the pattern for lead pin connection of a printed board and placing a lead pin on this pattern and soldering it. CONSTITUTION:A through hole 6 is formed in a pattern 1a for lead pin connection on a printed board 1, and a copper plating layer 7 is formed on the inside face of this hole, and a land part 8 of a copper pattern is formed on the opposite face of the board 1. A lead pin 2a of a vise 2 is placed on the pattern 1a, and the lower part and the side face of the pin 2a, the surface of the pattern 1a, the surface of the copper plating layer 7, and the surface of the land part 8 are connected into one body by a solder 5, thus mounting the vise 2 on the board 1. |
