| 摘要 |
PURPOSE:To increase the density of mounting, and to miniaturize an electronic device and accelerate its speed by forming a vertically penetrating metallic wiring, a surface electrode and a back electrode to a semiconductor base body and connecting these wiring and electrodes in three dimensions. CONSTITUTION:A plurality of semiconductor base bodies 2 are mounted to a circuit substrate 1 constituted by a printed wiring substrate, etc. in three dimensions. The base body 2 has metallic wirings 6 penetrating the inside of a substrate 4 toward the back from the surface of the semiconductor substrate 4, surface electrodes 7 formed to the surface of the substrate 4 and back electrodes 9 shaped to the back of the substrate 4. The base body 3 is also formed similarly. The base bodies 2, 3 are superposed, and both the surface electrodes 7 for the base body 2 and wirings for the base body 1 and both the back electrodes 9 for the base body 2 and the surface electrodes 7 for the base body 3 are connected. Accordingly, the density of mounting can be miniaturized and its speed accelerated. |
