ASSEMBLY DEVICES FOR ELECTRONIC CIRCUIT COMPONENTS

摘要

An assembly device for small electronic components such as IC chips, which comprises first and second elongated carrier means (for example, tapes), the second such means being disposed on the first such means and the latter having openings therethrough at predetermined intervals therealong through which the second carrier means projects. These projecting portions have adhesive surface regions to which the components adhere. The space required for storing the electronic components is much smaller than in conventional devices when the device is wound around a reel, and a plurality of the electronic components can be fed continuously with a relatively high reliability. Also, since the components 3 are not covered, it is easy to remove them by suction or mechanical means so that they can accurately be deposited one by one at the desired locations.