| 摘要 |
PURPOSE:To enable to remove any influence due to mechanical stress to generate when a semiconductor device is screw-mounted on a radiator by a method wherein the semiconductor element is made to contact to the heat radiating plate and is sealed with a resin, and a threaded hole for mounting is provided at nearly the central part of the device in a direction to intercross at a right angle with the lead-out direction of the external lead. CONSTITUTION:A semiconductor element 3 is fixed on one main face of a heat radiating plate 14 and the major part of a semiconductor device to be formed is sealed with a resin 2, including the semiconductor element 3, in such a way that a face of the major part corresponding to the one main face of the heat radiating plate 14 is made to expose. A threaded hole 56 for mounting is made to penetrate the resin 2 and the heat radiating plate 14 and one piece of semiconductor device is formed. Notch parts 28 are performed on the resin 2 in such a way that the notch parts 28 of parts; where are located at the center in a direction to intercross at a right angle with the lead-out direction of an external lead 4 and are located at both end parts of the side facing mutually with the side where the external lead 4 of the semiconductor proper of the heat radiating plate 14 is led out; are cut so deep that the one main face of the device is made to expose. This semiconductor device is installed on a radiator 6 having protrusions 8 by a screw 7. |
