| 摘要 |
The present invention relates to a plug-in arrangement for circuit boards and a process for tin plating contact pins of the arrangement. The present invention improves the tinning of winding end portions of a winding about nonmetallic contact pins on coil forms. The contact pins are adapted for connection with printed circuits. The present invention discloses contact pins in one piece, or with multiple parts, which pins are given a profiled configuration on an outer surface. The contact pins may have different profiled shapes or configurations including grooves. In the case of multiple part contact pins, gaps are provided between the parts. The grooves or gaps permit the escape of gas generated upon the burning of an enamel insulation layer on the winding end portions. Also, the end portions rest above bottoms of the grooves or gaps such that the end portions are surrounded with tin solder.
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