| 摘要 |
PURPOSE:To simplify a process, and to control quality easily by executing partial plating with gold, silver, etc. for bonding and plating to a sheath section with solder-tin, etc. in the same process. CONSTITUTION:A large number of lead pins 1 are formed to an IC lead frame A. The lead pins 1 are plated with silver 4 in size and shaped required as partial plating for bonding in a plating process. The whole surface of the lead frame A is plated with copper 5 as temporary plating for peeling before partial plating for sheathing. Said silver plated 4 sections are masked and outer lead sections 6 are plated with solder 7 as partial plating for sheathing. The frame A is dipped in a liquid for peeling, which does not damage silver plating, as a peeling process, and replacing plating 7 on sections for bonding are peeled and removed together with copper plating 5 as temporary plating for peeling. IC chips are bonded onto silver plating 4, and molded with a resin. |
