发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve flatness of the surface of an epitaxial layer by removing a polysilicone layer formed on an insulation film after the epitaxial layer is formed on all the surface. CONSTITUTION:An aperture is formed by patterning after an insulation film 2 is formed on a substrate 1. Then, an epitaxial layer 3 is formed on all the surface of the substrate 1. In this case, a polysilicone layer 4 is grown on the insulation film 2. Then, the polysilicone layer 4 is removed. Later, the remaining epitaxial layer 3 or the epitaxial layer continuous to the polysilicone layer is melted by using such as laser annealing, EB annealing or lamp flush annealing and the surface is flattened.
申请公布号 JPS6079711(A) 申请公布日期 1985.05.07
申请号 JP19830187554 申请日期 1983.10.06
申请人 MITSUBISHI DENKI KK 发明人 EGUCHI KOUJI;SAKURAI HIROMI;IKEDA TATSUHIKO
分类号 H01L21/762;H01L21/20;H01L21/268;H01L21/302;H01L21/3065 主分类号 H01L21/762
代理机构 代理人
主权项
地址