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发明名称
SEMICONDUCTOR SEALING RESIN COMPOSITION
摘要
申请公布号
JPS6079032(A)
申请公布日期
1985.05.04
申请号
JP19830187050
申请日期
1983.10.07
申请人
HITACHI SEISAKUSHO KK
发明人
NISHIKAWA AKIO
分类号
C08K3/36;C08G59/00;C08G59/62;C08L63/00;H01L23/29;H01L23/31
主分类号
C08K3/36
代理机构
代理人
主权项
地址
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