| 摘要 |
Metal-coated laminate which is particularly suitable for the manufacture of printed-circuit boards. It comprises a substrate, a layer 16 of coupling agent which has interacted, extending over and being bonded to a large surface area of the substrate, an ultra-thin copper layer 13 contiguous with the layer of coupling agent which has interacted and a composite bonding layer connecting the copper layer 13 and the layer of coupling agent which has interacted, the composite bonding layer comprising zones of copper alloyed with a second metal, which zones are encased in the oxide of this second metal. Application to printed circuits. <IMAGE>
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