| 摘要 |
PURPOSE:To mount a semiconductor element in good yield by brazing a temperature compensating plate for alleviating a strain at least on one surface of the element, wiring it, then coating an insulator, and then placing a case having an antiskid mechanism. CONSTITUTION:Temperature compensating plates 2, 3 are brazed to the front and back surfaces of a semiconductor chip 1, leads 9 are connected, and covered with glass. After sorting, they are mounted in parallel. Then, a supporting implement 12 of an elastic material matched in size to the plate 3 of the back side of the chip is arranged on a lower electrode 4 to support a semiconductor device to prevent the lateral movement. Then, an upper electrode 6 is covered to weld flanges 5, 7. The leads 9 are passed through a hole 8 of an insulator 8', after the flanges are welded, the hole 8 is caulked, and closed. According to this configuration, a semiconductor chip can be mounted in good yield. |
