SEMICONDUCTOR MODULE WITH A PLURALITY OF SEMICONDUCTOR ELEMENTS

摘要

A semiconductor module intended for use in the construction of d.c. chopper controllers for electrical vehicles comprises a mounting plate (10), an insulating housing (13) on the mounting plate (10), a plurality of semiconductor elements (T1, D1, D2, D3) in the interior of the insulating housing (13) and terminals (1 .... 6') for making the electrical connections between the semiconductor elements and their external circuit elements. The side of the insulating housing (13) remote from the mounting plate (10) is sealed by a heat sink (14). Detachably attached to the inside of the heat sink (14) are high-power semiconductor elements (T1, D1). Low-power semiconductor elements (D2, D3) are attached to the mounting plate (10) with an insulating ceramic plate (11) being inserted in between. Mounting plate (10) and heat sink (14) are detachably connected to the insulating housing (13).