| 摘要 |
PURPOSE:To protect an IC chip from the external light and ionic impurities by providing a non-light transmitting and insulating film not containing an alkaline metal component on a substrate, while forming thereon a chip and a bonding pad. CONSTITUTION:A wiring film 2 forming the anode display part 6 on a substrate 1A is wired as being extended up to the vicinity of an IC chip on a substrate 1B, while being electrically connected to a specific bonding pad 60 through a connection hole 70 provided on an insulating film 50. The insulating film 50 contains the components, for instance, SiO2 17%, B2O3 13% and PbO 70%, while being formed of a compositioned cosisting of a coloring agent made of a mixture of metal oxides and an organic binder. Subsequently, a CMOSLSI chip 15 is die-bonded on the insulating film 50 with an insulating epoxy resin 16. Next, the wire bonding is performed to electrically connect an aluminium electrode on the chip 15 to the pad part 60. Further, a ceramic cap made of an alumina substance is provided as a protective cap 19. |
