发明名称 |
DIAMOND HEATSINK ASSEMBLIES |
摘要 |
A diamond heatsink for semiconductor devices comprises a stud into which the diamond is pressed. The stud is held by friction in the end of a hollow split cylindrical holder. The holder is clamped in a base or wall member by a locknut which is screwed into the base or wall member and urges two half-conical collets into contact with the holder. The holder is also mounted by a screw thread in the locknut to allow the position of the semiconductor device to be adjusted. |
申请公布号 |
GB2147145(A) |
申请公布日期 |
1985.05.01 |
申请号 |
GB19840023018 |
申请日期 |
1984.09.12 |
申请人 |
THE * PLESSEY COMPANY PLC |
发明人 |
RALPH MELVILLE * EATON;MICHAEL WILLIAM * GEEN |
分类号 |
H01L23/373;H01L23/40;(IPC1-7):H01L23/12;H01L23/36 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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