发明名称 DIAMOND HEATSINK ASSEMBLIES
摘要 A diamond heatsink for semiconductor devices comprises a stud into which the diamond is pressed. The stud is held by friction in the end of a hollow split cylindrical holder. The holder is clamped in a base or wall member by a locknut which is screwed into the base or wall member and urges two half-conical collets into contact with the holder. The holder is also mounted by a screw thread in the locknut to allow the position of the semiconductor device to be adjusted.
申请公布号 GB2147145(A) 申请公布日期 1985.05.01
申请号 GB19840023018 申请日期 1984.09.12
申请人 THE * PLESSEY COMPANY PLC 发明人 RALPH MELVILLE * EATON;MICHAEL WILLIAM * GEEN
分类号 H01L23/373;H01L23/40;(IPC1-7):H01L23/12;H01L23/36 主分类号 H01L23/373
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