| 摘要 |
PURPOSE:To obstruct trouble resulting from the large thermal expansion of a buffering agent, to reduce the deterioration of an element and to improve reliability by forming the curved section of an upper electrode body and forming a hole closed by the buffering agent to the upper electrode body. CONSTITUTION:An upper electrode conductor 5 has a hole 9 opened toward a lower section in a vertical section 54 besides a curved section 53 having flexibility. The end of the curved section 53 forms a contact section 55. The contact section 55 is brazed to the upper surface of a semiconductor chip 4, and a buffering agent 8 is applied and cured so as to cover both the chip and the hole 9. The whole is wired, and lastly sealed by a casting material 7. Since a cavity section 9 coexists, stress by the buffering agent 8 is reduced because the expanded volume section of the buffering agent 8 is absrbed to the cavity section 9 on the temperature rise of a temperature cycle. Accordingly, stress sigma1 is absorbed by the buffering agent 8, sigma2 by the curved section 53 easy to be varied and the stress sigma3 of the buffering agent by the cavity section 9 severally approximately. |
