| 摘要 |
PURPOSE:To enable to inspect the characteristics of a semiconductor wafer without decreasing the number of pieces of plural integrated circuit chips, each having a prescribed logical circuit, among the chips by a method wherein the integrated circuit chips for semiconductor wafer characteristic inspection are disposed outside of the effective area of the semiconductor wafer. CONSTITUTION:In a semiconductor wafer 11, integrated circuit chips 13, each having been formed in a complete shape and having a prescribed logical circuit, have been arranged on the whole surface of the wafer 11 in a semiconductor wafer effective area 12. Outside of the effective area 12 have been arranged integrated circuit chips 14a, 14b, 14c and 14d for semiconductor wafer characteristic inspection. According to such a way, it is possible that the integrated circuit chips for semiconductor wafer characteristic inspection are inspected at all the positions of the 14a-14d and it becomes possible that plural integrated circuit chips 13, each having a prescribed logical circuit, are disposed at all positions in the effective area of the semiconductor wafer 11. |
