发明名称 MOLD RELEASING METHOD BY ULTRASONIC WAVE
摘要 PURPOSE:To separate a photoelement from a base mold simply in a short time by applying ultrasonic vibration to the adhesion body composed of the base mold and the photoelement. CONSTITUTION:When a photoelement is formed by a plastic replica method, after the adhesion body composed of a base mold 5 and a photoelement 6 has been formed, the adhesion body is fixed onto a pedestal 7 so as to keep the part of the base mold 5 above said body. Next, after a horn 3 has been caused to adhere to the surface opposite to the adhesion surface between the base mold 5 and the photoelement 6, an ultrasonic generator 1 and vibrator 2 are operated, thereby generating ultrasonic vibration. This ultrasonic vibration is applied to the adhesion body through the horn 3 and an intervening member 4, whereby the adhesion body is separated at between the base mold 5 and the plastic replica 6b.
申请公布号 JPS6076319(A) 申请公布日期 1985.04.30
申请号 JP19830183693 申请日期 1983.10.01
申请人 CANON KK 发明人 YOSHIKAWA HIDEO
分类号 B29C33/44;B29C43/50;B29L11/00 主分类号 B29C33/44
代理机构 代理人
主权项
地址