| 摘要 |
PURPOSE:To facilitate an assembly process, to improve the shock-absorbing properties of a device and to lighten device itself by integrally molding and manufacturing a package for the EPROM device through the compression and injection of an insulating resin. CONSTITUTION:An EPROM chip 22 is die-bonded with an element loading section 21a for a lead frame 21 by using the lead frame 21 processed to a wiring pattern shape. The chip 22 is wired-bonded by metallic small-gage wires 23, such as gold wires or aluminum wires or the like. The lead frame 21 is turned over, and placed on a box body 24 with the bottom manufactred by a material permeating the box body. A resin 25 through which ultraviolet rays are permeated filled so as to form approximately the same surface as the lead frame 21. The lead frame 21 on which the EPROM chip 22 is loaded is set to a resin molding die 27 after the completion of filling, and an insulating resin 26 is compressed and injected into the die 27 to mold a package consisting of the resin, thus completing an EPROM device. |
