发明名称 Surface-structured die for imprinting plastics boards
摘要 The die is composed of an electrolytically treated metal layer which is refined on the surface. The metal layer (2,3) may have its reverse side fixed to a carrier body (1). There may be a metal layer on each side of the carrier body. The reverse sides of the metal layers may be fixed directly to each other. The thickness of the metal layer can be anything from 0.1 cm to several cm.
申请公布号 FR2553709(A1) 申请公布日期 1985.04.26
申请号 FR19840015988 申请日期 1984.10.18
申请人 HUECK EDUARD 发明人 ROBERT WALTER ET WILFRIED SUSS;SUSS WILFRIED
分类号 C25D1/10;(IPC1-7):B29C59/02;C25D1/20;C25D5/54 主分类号 C25D1/10
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