| 摘要 |
PURPOSE:To enable an IC module to dissipate heat effectively, and to contrive the mounting the modules at high density by a method wherein a closed container of polygonal form having the side surface consisting of a plurality of planes is filled with a liquid coolant, and the modules are stuck on the planes. CONSTITUTION:A heat dissipating container 1 is made up of a polyhedron having the side surface 2 consisting of six planes and is provided with pleat-form hollow fins 3 in the upper part. The inside of this container is filled with the liquid coolant 4 such as fleon. Six IC modules 5 are suck on the six side surface of the closed container 1, respectively. The module is constructed concretely by the mounting of a plurality of IC chips 7 on a substrate 6 of good thermal conductivity, and the substrate is provided e.g. at the bottom side end of the container with a connection terminal 8 for electrical connection to electric apparatus. Since the titled device is thus constructed, the IC chips are thermally connected to the coolant via substrate and the side surface 2 of the container. |
