| 摘要 |
PURPOSE:To enable unification of the precisions in shape and dimensions and to improve work efficiency by inserting a clip pin in a hole in the bottom of a case and by pouring and molding molten resin in a case in which an integrated circuit substrate is pressed into the clip pin. CONSTITUTION:A plurality of small-diametered clip pin inserting holes 81 are formed in the bottom of a metallic case 8 so that a clip pins 3 is inserted into the insertion hole 81. A hybrid integrated circuit substrate 1 provided with a lead terminal 2 and a part 4 to be mounted is inserted into the case 8. A molten resin 10 is poured from a pouring bottle 9 into the case 8. The resin 10 is pulled out from the case when cured, and a substrate 1 having a shape and dimension restricted by the case 8 can be made. |
