发明名称 SEALING JIG FOR SEMICONDUCTOR DEVICE PACKAGE
摘要 PURPOSE:To controve to improve the reliability, manufacturing yield, production efficiency, and flexibility by a method wherein the corner of a chip carrier on the diagonal is pressed from both sides with two strips of positioning plates having cuts, and is then set on a supporting plate. CONSTITUTION:The titled jig is composed of the supporting plate 2 made of stainless supporting chip carriers and a plurality of strips of positioning plates 3', 3'... screwed by arrangement in parallel with this plate 2. The positioning plates are shifted in positioning according to the dimensions of a ceramic cap 6 and a ceramic substrate 7, adjusted in the gap between cuts 9 and 9 opposed to each other, and screwed to the plate 2 by the fitting of the corners of the chip carrier 1 on the diagonal to the cuts 9 and 9 and the holding of the corners. When the rectangular chip carrier is set to the sealing jig, the positioning plate 3' is slid left and right, and the corners of the carriers 1 on the diagonal are set so as to fit in the cuts 9 and 9 at right angles, and are acrewed with a washer 8 and a screw 4.
申请公布号 JPS6074653(A) 申请公布日期 1985.04.26
申请号 JP19830182247 申请日期 1983.09.30
申请人 NIPPON DENKI KK 发明人 SUZUKI KATSUHIKO
分类号 H01L23/02 主分类号 H01L23/02
代理机构 代理人
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