摘要 |
PURPOSE:To prevent the reaching of alpha-rays to a semiconductor chip while obviating the working of shearing stress to a bonding wire by bonding an alpha-ray shielding tape to an active region with the exception of a pad section for the semiconductor chip. CONSTITUTION:An alpha-ray shielding tape 4 is constituted by a filler member 6, in which a filler material, such as silicon powder, silicon oxide, etc. i mixed into a silicone resin, and an adhesive layer 5 consisting of the silicone resin, and bonded onto the surface of an active region section with the exception of pads 7 on a semiconductor chip 1. alpha-rays from a molding resin do not reach to an alpha-ray shielding section because their energy is lost by the silicone resin in the alpha-ray shielding tape 4. When the device is used for a semiconductor element for a dynamic RAM, an error, etc. on writing to t memory cell are not generat- ed. The application of stress to wires 2 can be prevented by the difference of thermal expansion coefficients because the wires 2 are coated only with the molding resin. |