| 摘要 |
<p>PURPOSE:To contrive to improve the reliability by enabling the absorption of the thermal expansion of a buffer agent by a method wherein the side wall of a package is provided with a projection having an air gap opening downward. CONSTITUTION:The side wall 1 has the projection 11 hook-formed in cross-section. The part of the projection projecting out of the side wall vertically is nearly at the same level as the upper surface of the buffer agent 9 coating a semiconductor chip 3. The air gap 12 formed between the projection and the side wall and opening downward is not filled with the buffer agnet at the time of filling, but most part remains as the air gap. Therefore, even when the agent expands in operation of the titled device with mold resin 10 cast on the agent, its expansion escapes to this air gap; thereby enabling the alleviation of the internal stress. It is sufficient that the air gap is not provided over the whole circumference of the projection, and it can be provided in part as a hole or groove opening downward. Besides, the projection can be provided in part of the side wall of the package instead of over the entire surface thereof. Moreover, the position of the projection can be utilized as the standard for the amount of filling the agent.</p> |
