| 发明名称 |
Mounting for at least one semiconductor component |
| 摘要 |
The invention relates to a low-capacitance mounting, in particular for lossy semiconductor components, for example IMPATT diodes, which can be manufactured inexpensively. This is achieved with the aid of a diamond body (heat sink) having a trench-like recess containing the connected semiconductor component. |
| 申请公布号 |
DE3336867(A1) |
申请公布日期 |
1985.04.25 |
| 申请号 |
DE19833336867 |
申请日期 |
1983.10.11 |
| 申请人 |
LICENTIA PATENT-VERWALTUNGS-GMBH |
发明人 |
BEHR,WOLFGANG,DIPL.-PHYS. |
| 分类号 |
H01L23/04;H01L23/13;H01L23/373;(IPC1-7):H01L23/12;H01L23/48;H01L29/88;H01S3/18 |
主分类号 |
H01L23/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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