| 发明名称 |
PROCESS FOR DEPOSITING METALLIC COPPER |
| 摘要 |
Metallic copper is deposited on a substrate by confining the vapour of a fluorinated organic copper compound in an enclosed chamber containing the substrate, and decomposing the copper compound by subecting it to light. |
| 申请公布号 |
ZA8406889(B) |
申请公布日期 |
1985.04.24 |
| 申请号 |
ZA19840006889 |
申请日期 |
1984.09.03 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
THOMAS HALL BAUM;FRANCES ANNE HOULE;CAROL RUTH JONES |
| 分类号 |
H05K3/14;C23C16/18;H01L21/28;H01L21/285 |
主分类号 |
H05K3/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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