发明名称 PLATING METHOD FOR COMPOSITE MEMBER
摘要 PURPOSE:To improve the adhesiveness of a metallic film formed to a metallic part in a composite member consisting of the metallic part and synthetic resin parts by forming the metallic film to the metallic part then forming the metallic film over the entire part of the composite member. CONSTITUTION:An Ni film is first formed only to the part of a spring 2 made of a thin stainless steel of a button device 1 by a degreasing-pickling-Ni electroplating stage in the button device 1 consisting of the spring 2 and buttons 3 made of an ABS resin of a plating grade. The entire part of the device 1 is then treated by an etching liquid to roughen the button 3 surface and thereafter the roughened surface is applied with a catalyst by a conventional practice. The surface is further subjected to an activation treatment then to Ni chemical plating. The Ni film is subjected successively to strike nickel, bright nickel and ornamental plating and is dried with freon after a chemical conversion treatment. The exfoliation and staining of the plating film are thereby prevented.
申请公布号 JPS61235568(A) 申请公布日期 1986.10.20
申请号 JP19850075058 申请日期 1985.04.09
申请人 SONY CORP 发明人 WATANABE YOSHIO;FUEKI SHIMETOMO
分类号 C23C18/18;C23C28/00 主分类号 C23C18/18
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