Method of measuring the thickness of the removed layer in subtractive workpiece processing

摘要

A test sample (7) of the same material, or with the same structure as the workpiece (5) exposed to subtractive processing is simultaneously exposed to such processing and consists of a wedge (10) with the angle alpha covered by two covering plates (11) which are complementary to its two surfaces (14). By measuring the distance x1 between the thus formed gaps (15), and by comparing it with the original distance xO, thickness z of the respectively removed layer can be determined from the equation <IMAGE>