| 摘要 |
PURPOSE:To obtain a highly reliable ceramic package without giving any bad influence on an IC chip and also without deteriorating the alpha ray absorptive power by a method wherein the whole ceramic carrier is held at temperatures of a degree than a polyimide resin coated on the IC chip is not thermally decomposed and the sealing parts only are locally heated. CONSTITUTION:An IC chip 6 is fixed in a ceramic cavity 3 by die-bonding and is wired by wire-bonding. A ceramic cap 2 is set in a ceramic carrier through sealing glasses 4 and the whole ceramic carrier is set in the recess of a heat block 1. In this condition, the heat block 1 is conducted and the whole package is heat-held, including the ceramic cavity 3, the ceramic cap 2, etc. The heating temperatures at this time shall be less than the decomposition temperature of a polyimide resin 5 coated on the surface of the IC chip 6. Then, the parts of the sealing glasses 4 are locally heated from the upper side of the ceramic cap 2 using an infrared heating device, etc., at more than the fusion temperature of the sealing glasses 4 for a prescribed hours and the sealing glasses 4 are cooled, after being fused, thereby enabling to complete sealing of the ceramic package. |
