| 摘要 |
PURPOSE:To arrange monolithic light-emitting element arrays in one horizontal row by setting the orientation of a crystal axis so that the cut surface and cleavage plane of a chip are conformed in the light-emitting element arrays formed on a compound semiconductor having zinc blend structure. CONSTITUTION:A substrate 5 on which monolithic LED arrays having high density are formed is made to be a (001) plane, the cut surfaces of both ends of a chip are made to be cleavage (110) planes, and the LED arrays are formed repeatedly to the whole substrate, but the substrate is cut so that light-emitting sections only in number previously determined are shaped as 128 bits and 256 bits in one chip. The light-emitting sections 6 are formed on the center line of the substrate 5 with high density, and lead wire electrodes 7 are drawn out alternately to both sides of the electrodes 7. Since clearances among P-N junctions 8 can be cut sharply in the vertical direction of a substrate surface by utilizing cleavage, cutting clearance sections can be shrunk, and the cutting clearance sections are small even when a plurality of chips are arranged in one horizontal row, thus generating no section to which printing is not enabled. |
