| 摘要 |
<p>PURPOSE:To omit one part of a metallic wire, and to reduce the size of a chip by utilizing a lead with a tab for a power supply feeding wiring. CONSTITUTION:A pad as one of an upper and group 4 is connected electrically to a lead 1 with a tab by a connector wire 5, and a pad as one of a lower pad group 4 is similarly connected electrically to the lead 1 with the tab by a connector wire 5. Aluminum power supply wirings 9 and 9' are extended from each pad electrically connected to the lead with the tab, and arranged so as to supply each power supply for an upper region and a lower region (sections to which output buffers are formed) in a semiconductor pellet 2. That is, the mutual wirings of a pair of aluminum wirings 9 and 9' are attained by the lead 1 with the tab, and power supplies are fed through the lead with the tab. Accordingly, a wide aluminum wiring extending over a lower side end section from an upper side end section in the pellet 2 is unnecessitated.</p> |
