发明名称 SPUTTERING DEVICE
摘要 PURPOSE:To improve the quality of the film formed on a substrate by stopping temporarily sputtering while the plasma condition after abnormal discharge is unstable when the abnormal discharge arises in the stage of depositing sputtering particles to the substrate. CONSTITUTION:A DC power source 50 is operated by the conventional method to generate DC discharge between a cathode 20 and anodes 40 and to sputter a target material 70 thereby forming a film on the surface of a substrate 80. When abnormal discharge arises in this operation, said discharge is detected by the DC power source 50 and the detection signal (a) thereof is outputted to a microcomputer 60. The microcomputer 60 outputs the control signal (b) to the power source 50 upon receiving of the signal (a) to make the output current from the power source 50 to zero or small during the period when the plasma condition after the abnormal discharge is unstable thereby stopping temporarily the sputtering. The quality of the film on the substrate 80 is thus improved.
申请公布号 JPS6070174(A) 申请公布日期 1985.04.20
申请号 JP19830178280 申请日期 1983.09.28
申请人 HITACHI SEISAKUSHO KK;HITACHI SANKI ENGINEERING KK 发明人 SHIROO KAZUHIRO;KATOU SHIGEKAZU
分类号 C23C14/54;C23C14/34;H01L21/203;H01L21/31 主分类号 C23C14/54
代理机构 代理人
主权项
地址