发明名称 SEMICONDUCTOR LEAD FRAME FEEDING DEVICE
摘要 PURPOSE:To contrive improvement in operationability of the titled device by a method wherein the lead frames located on the different plane surfaces are placed in aligned and superposed form for each section, they are pulled out one by one, a new lead frame is replenished therein, the pulled-out lead frame is conveyed to a bonding device, and all these operations are automatically controlled. CONSTITUTION:The lead frames 20, 20... are horizontally lined up on a guide rail 12, and they are pressurized by the pressurizing mechanism 13 containing a weight 13a in the direction as shown by a heavy arrow in the diagram. A pin 17 of the chuck 16 part of a conveying mechanism 15 is inserted into the hole of the lead frame. When a feeding signal is outputted, the chuck 16 is clampled by a clamping plate 16a and performs a 180 deg. rotation with its shaft as the center point after the lead frame has been lifted up by several millimeters from the lined- up position. The lead frame is conveyed in the horizontal direction as shown by the arrow A in the diagram, lowered and placed on the positioning head 5 of an automatic die-bonding device, and after the lead frame has been positioned at this point, it is sent into the automatic die-bonding device. The chuck 16 is operated reversely and then repeats a conveying operation. When a replenishment operation is going to be performed, the pressurizing block 13c is fixed in the direction of the arrow C, and the lead frame is alined on the guide rail. As a result, the replacement of magazine is unnecessitated, and the rate of operation of the automatic die-bonding device can be improved.
申请公布号 JPS6068622(A) 申请公布日期 1985.04.19
申请号 JP19830176486 申请日期 1983.09.26
申请人 TOSHIBA KK 发明人 IKEDA SHIZUO
分类号 B25J11/00;H01L21/50 主分类号 B25J11/00
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