| 发明名称 |
SOLDERABLE ELECTRICALLY CONDUCTING FILM |
| 摘要 |
A solderable electrically conductive film is formed on a substrate by forming a film-forming composition comprising polyimide, solvent therefor and dispersed metallic nickel particles. This composition is applied to the substrate, dried and cured to leave the film which comprises nickel particles dispersed in polyimide. |
| 申请公布号 |
AU3374884(A) |
申请公布日期 |
1985.04.18 |
| 申请号 |
AU19840033748 |
申请日期 |
1984.10.01 |
| 申请人 |
ELECTRO MATERIALS CORP. OF AMERICA |
发明人 |
FRANK WAYNE MARTIN;FRANK ST. JOHN |
| 分类号 |
H05K3/12;C09D5/24;C09D179/08;H01B1/22;H05K1/09 |
主分类号 |
H05K3/12 |
| 代理机构 |
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代理人 |
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